RF/Microwave Engineer, Simulation and Analysis Engineer

RF Engineer experienced in power generators. Simulation and Analysis Engineer in Automotive industry. I was executing PI/SI simulation in 2.5D and 3D simulation tools like Ansys, AWR, HL. 4y industry and 2y acadmic experience.

• Ansys2 J.
• Antennenanlage / Antennentechnik1 J.
• AWR Microwave Office
• Corporate Design2 J.
• Elektronik2 J.
• Hardware-Design2 J.
• Highspeed
• Hochfrequenztechnik1 J.
• Measurement
• RF engineering
• VNA

RF Electronics Engineer – TRUMPF Huettinger Sp. z o.o.
July 2023 – Present

• Design of high-power RF amplifiers (>1 kW) and RF filters (passive and active).

• Development of a V/I probe based on a PCB Rogowski coil — including concept, pre-/post-layout simulations, and validation.

• Simulation work using AWR (Circuit, AXIEM, Clarity) and Ansys Electronics Desktop (HFSS, SIwave, Circuit).

• Component selection, schematic design in OrCAD Capture, and PCB layout in Cadence Allegro.

• Circuit validation and testing using VNA, oscilloscope, spectrum analyzer, signal generator, and power meters.

• Created the concept and supervised the implementation of TruTest, a platform for automated RF amplifier testing.


Electrical Simulation & Modeling Engineer – Aptiv S.A.
July 2021 – June 2023

• Signal integrity analysis for high-speed interfaces such as GMSL/FPD-Link, CSI, MII, SGMII, RGMII, and Ethernet.

• Full 3D modeling and simulation including connectors, housings, and component models (SPICE / Touchstone).

• Power integrity analysis (decoupling and DC drop simulations).

• RF analysis and optimization of antennas for Bluetooth and Wi-Fi applications.

• Simulation and verification performed in Ansys Electronics (HFSS, 3D Layout).


? Technical Skills

•Simulation & Modeling: Ansys HFSS, SIwave, AWR, Clarity, 3D Layout

•PCB Design: OrCAD Capture, Cadence Allegro

•Measurements & Validation: VNA, oscilloscope, spectrum analyzer, signal generator, power meters

•RF Design: High-power amplifiers, filters, antennas, V/I probes

•Signal & Power Integrity: Channel modeling, decoupling, DC drop analysis

found in profile qualification
•“Radiation Pattern Shaping of Radiating Element by Housing Model Providing Deflecting Wave Features” (Oct.
2024). In: url: -Hyperlink entfernt-.

• “Scalable Antenna Arrays Featuring Stable Radiation Pattern in Multioctave Bandwidth” (Feb. 2023). In: IEEE
Transactions on Antennas and Propagation 71.2, pp. 1478–1492. url: -Hyperlink entfernt-
document/9935778.

•“Octave-Band Four-Beam Antenna Arrays with Stable Beam Direction Fed by Broadband 4 × 4 Butler Matrix”
(Sept. 2021). In: MDPI Electronics 10.21. url: -Hyperlink entfernt-2.

• “Octave-Band Three-Beam Scalable Antenna Array Fed by Broadband 4 × 4 Butler Matrix” (Sept. 2022). In:
2022 24th International Microwave and Radar Conference (MIKON). url: -Hyperlink entfernt-
document/9924703.

• “Octave-Band Three-Beam Antenna Array With Broadside Beam Fed by Broadband Butler Matrix” (Sept. 2022).
In: 2022 IEEE AP-S/URSI, pp. 2200–2300. url: -Hyperlink entfernt-.

•“”Broadband Antenna Array Based on the LTS Radiating Element”” (n.d.). In: Ansys/SymKom Simulation
Conference 2022 ()

Awards
• Award (1’st place) for the best Master Thesis in the XXIV edition of the competition for the diploma thesis
“INNODIAMENT”
• Award (3rd place) for the Best Master’s Thesis in the XXIV edition of the “AGH Diamonds” competition
for diploma theses.
• Award for the Best Master’s Thesis defended at the Institute of Electronics in the 2021/2022 academic year.
• Award in the 2021 IEEE (Polish Section) competition for the Best Bachelor’s Thesis.