Interim Management Halbleiter & Automotive | Produktion | QM | Audits | Projektleitung

1/2023 – 3/2023

- Unterstützung der Geschäftsführung beim Erstellen eines Businessplans für eine innovative Geschäftserweiterung der Firma im Bereich Industry 4.0, Fokus insbesondere auf Markteintritt, operative Umsetzung und Financials
- Zusätzlich Tätigkeiten im operative Geschäft, insbesondere Abhalten von Daily Scrum sowie Projekt Management und Fortschrittskontrolle & Priorisieren bei Software Entwicklungsprojekten

Business Analysis, Geschäftsfeldstrategie, Scrum

3/2022 – 11/2022

Werksleitung fuer Photomaskenfertigung

Management (allg.), Werkleitung

7/2021 – 11/2021

I was contracted by an Investment Group from Singapore to conduct a technical due diligence study for a novel acoustic MEMS device. While the device had superior performance under lab conditions, the question was whether the manufacturing process was mature to be scaled to mass production at viable cost in order to justify an investment in this technology.

The technical due diligence comprised:
- Review of the complete process flow (60+ steps, 6 photo layers, 2 deep etch steps) with regards to process & yield risks using FMEA methodology
- Estimation of total line yield (Die loss & wafer loss)
- Cost model for the device using a dedicated fab for the device
- CapEx proposal (Machinery, Cleanroom) for a dedicated fab

The technical due diligence was presented to the investors to conclude on the investment decision. A total of 650 hours were charged, the work was done in the labs in Thailand and Singapore , and remotely.

Finanzanalyse, Investitionsrechnungen, Kostenrechnung, Mikrotechnik, Mikrotechnische Fertigung, Risikoanalyse

1/2016 – 12/2021

Led 24/7 semiconductor backend and wafer-level packaging operations in a high-mix international subcontracting environment serving automotive and industrial customers. Full operational responsibility for manufacturing, engineering, planning, quality, supply chain, business systems and site profitability.

Managed a site organization of 150 employees with strong customer interaction in technically demanding and cost-sensitive environments.

Key achievements:

Increased factory loading from ~12k to >20k wafers/month through operational optimization and customer-focused capacity management
Improved on-time delivery performance from ~60% to >90% by stabilizing planning, manufacturing and supply-chain execution
Increased manufacturing yield to 99.8% through structured process improvement and Six Sigma methodologies
Achieved IATF 16949 qualification and successfully expanded automotive business activities
Implemented cost reduction and operational efficiency initiatives in a highly margin-sensitive subcontracting environment
Strengthened cross-functional collaboration across manufacturing, planning, engineering, quality, SCM, IT and operational finance
Developed organizational accountability and decision-making capabilities across management and engineering teams

Technology exposure included:
Ni/Au and Cu plating, PVD, evaporation, lithography, dicing, backgrinding, SMT, pick & place and automated inspection systems

After sales management, Einkaufsverhandlungen, Halbleiter, Mikrotechnische Fertigung, Prozessmanagement, Prozessoptimierung, Qualitätsmanagement / QS / QA (IT), Six sigma, Werkleitung

1/2013 – 12/2015

Led operations for a 24/7 semiconductor wafer fabrication facility in Singapore with responsibility for manufacturing, planning, industrial engineering, business systems and IT.

Managed an organization of 75 employees and served as part of the site leadership team reporting to VP Operations.

Key responsibilities and achievements:

Supported greenfield semiconductor fab setup including MES, SAP and manufacturing business systems implementation
Led technology transfer and production ramp-up activities from UK manufacturing operations to Singapore
Managed manufacturing performance across cycle time, yield and operational efficiency targets
Coordinated cross-functional activities across manufacturing, planning, engineering and business systems
Supported operational transition activities following the Infineon acquisition of International Rectifier

Fertigungstechnik (allg.), Halbleiter, Produktionsleitung

2/2011 – 12/2012

Led industrialization and transfer of advanced semiconductor backend technologies from R&D into stable high-volume manufacturing environments.

Technology focus included:

Wafer thinning
Metallization
Dicing
Inspection
Photolithography & etch
Coordinated transfer activities between UK R&D and Singapore manufacturing operations
Supported process stabilization, manufacturing readiness and production ramp-up activities
Worked closely with engineering, manufacturing and equipment teams in international semiconductor environments

Halbleiter

7/2007 – 11/2010

Led technology transfer and industrialization activities for advanced semiconductor packaging and wafer-level processing technologies from US R&D environments into high-volume manufacturing in Singapore.

Technology focus included:

Cu pillar bumping
Cu redistribution layer (RDL)
Lead-free bumping
Polyimide processing
Wafer-level packaging (WLP)
8” to 12” manufacturing conversion

Key responsibilities and achievements:

Coordinated cross-functional transfer activities between R&D, process engineering, manufacturing and equipment engineering teams
Supported ramp-up and stabilization of advanced packaging technologies in high-volume OSAT manufacturing environments
Contributed to manufacturing readiness for fine-pitch and high-density interconnect technologies relevant to next-generation semiconductor packaging
Worked within international customer-driven semiconductor development and industrialization programs

Halbleiter

12/1999 – 6/2007

Engineering Manager

Jun 2005 - Jul 2007 · 2 yrs 2 mos

Singapore

Led process and equipment engineering activities for wafer-level packaging operations focused on optical sensor applications.

Key responsibilities included:

Managing engineering teams supporting wafer-level packaging manufacturing operations
Supporting process optimization and manufacturing stabilization activities
Coordinating process, equipment and production-related improvement initiatives
Driving technology transfer and industrialization activities between Germany and Singapore manufacturing sites

Process Integration Manager

Jun 2004 - Jun 2005 · 1 yr 1 mo

Berlin, Germany

Responsible for process integration activities for advanced wafer-level packaging technologies for optical devices.

Planned and coordinated technology transfer from Germany to Singapore manufacturing operations
Supported cross-functional integration between development, process engineering and production teams
Contributed to industrialization and manufacturing readiness of new packaging technologies

Inhouse Consultant

Dec 1999 - Jun 2004 · 4 yrs 7 mos

Mainz, Rhineland-Palatinate, Germany

Supported manufacturing and technology-related consulting projects within precision manufacturing and optical production environments.

Focus areas included:

Precision manufacturing processes
Optical manufacturing technologies
Manufacturing optimization and process improvement

Optik / technische Optik, Projektmanagement