freiberufler FEM & Multiphysics Simulation Engineer (COMSOL), PhD | Thermal · Structural · Piezo/MEMS · Python auf freelance.de

FEM & Multiphysics Simulation Engineer (COMSOL), PhD | Thermal · Structural · Piezo/MEMS · Python

zuletzt online vor wenigen Stunden
  • 85€/Stunde
  • 13055 Berlin
  • DACH-Region
  • ur  |  en  |  de
  • 27.10.2026
  • Contract ready

Kurzvorstellung

Simulation engineer and PhD physicist. FEM and multiphysics models in COMSOL for thermal, structural, piezoelectric/MEMS and semiconductor problems, validated against real measurements. Python automation for design studies. Remote, English.

Geschäftsdaten

 Freiberuflich

Qualifikationen

  • COMSOL Multiphysics
  • Datenanalyse6 J.
  • Finite-Elemente-Methoden6 J.
  • Halbleiter6 J.
  • Multiphysik-Simulation
  • Piezoelektrik / MEMS
  • Python6 J.
  • Sensorik
  • Strukturmechanik
  • Thermische Simulation

Projekt‐ & Berufserfahrung

Guest Scientist, Analytical & FEM Modelling (Festanstellung)
Paul Drude Institut für Festkörperelektronik (PDI), Berlin
8/2021 – 4/2022 (9 Monate)
Hochschulen und Forschungseinrichtungen
Tätigkeitszeitraum

8/2021 – 4/2022

Tätigkeitsbeschreibung

Developed a closed-form analytical model linking shell thickness and core diameter to the curvature of bent GaAs core-shell nanowires. Implemented and verified the model in Python and COMSOL Multiphysics. Built FEM simulations of strain fields and intrinsic electric fields (piezoelectric and flexoelectric) in bent nanowires, switching the flexoelectric term on and off to separate its contribution, supporting partner photoluminescence studies. Developed a carrier drift-diffusion model under piezo- and flexoelectric fields.

Eingesetzte Qualifikationen

Physik, Finite-Elemente-Methoden, Halbleiter, Berechnungen, Python

Postdoctoral Researcher, Multiphysics Simulation (Festanstellung)
Universität Siegen, Siegen
5/2021 – 5/2024 (3 Jahre, 1 Monat)
Hochschulen und Forschungseinrichtungen
Tätigkeitszeitraum

5/2021 – 5/2024

Tätigkeitsbeschreibung

Built coupled multiphysics FEM models in COMSOL (optical absorption, carrier drift-diffusion, heat transport and elastic wave propagation) for semiconductor nanostructures, and validated them against ultrafast experimental data; the models explained how vibrational modes are excited inside the structures. Wrote Python pipelines for automated data acquisition, signal processing and analysis, cutting the analysis cycle from days to hours. Ran parametric studies over geometry and material parameters. Coordinated proposals, reports and milestones across a multi-institute team.

Eingesetzte Qualifikationen

Datenanalyse, Finite-Elemente-Methoden, Halbleiter, Physik, Projektkoordinator, Python

Doctoral Researcher (joint PhD), Nanomechanics & Numerical Modelling (Festanstellung)
Universität Siegen & Aix-Marseille Université, Siegen
8/2017 – 3/2021 (3 Jahre, 8 Monate)
Hochschulen und Forschungseinrichtungen
Tätigkeitszeitraum

8/2017 – 3/2021

Tätigkeitsbeschreibung

Mechanical testing of semiconductor nanowires (in-situ three-point bending) in the large-deflection, geometrically nonlinear regime; quantified elastic properties and strain response versus composition and geometry. Measured strain with digital image correlation on in-situ SEM image sequences, using my own Python correlation code, and cross-checked it with X-ray diffraction. Modelled stress-driven defect diffusion (Gorsky effect) by self-consistently solving coupled nonlinear drift-diffusion PDEs, validated against experiment. FIB/SEM imaging and EBSD orientation mapping. Six peer-reviewed publications.

Eingesetzte Qualifikationen

Datenanalyse, Finite-Elemente-Methoden, Halbleiter, Mikroskopie, Physik, Python

Ausbildung

Universität Siegen & Aix-Marseille Université
Dr. rer. nat. in Physics (magna cum laude), joint PhD
Universität Siegen & Aix-Marseille Université
2021
Siegen
Universität Siegen
M.Sc. in Physics (grade 1.7)
Universität Siegen
2017
Siegen

Über mich

Simulation engineer and PhD physicist. I build FEM and multiphysics models in COMSOL that answer concrete engineering questions: how hot does it get, where does it deform or fail, how does a sensor or device actually respond. Every model is checked against measured data, so you get results you can rely on, not just colourful plots.

Typical problems I solve:
• Thermal and thermo-mechanical analysis: heat loads, transient heating, thermal stress and deformation
• Structural mechanics: nonlinear and large-deformation analysis, stress and strain concentrations
• Piezoelectric and electromechanical devices: sensors, actuators, MEMS, acoustic-wave (SAW) devices
• Semiconductor device physics: carrier transport (drift-diffusion), coupled electro-thermal effects
• Python automation: parameter sweeps, design studies, post-processing, reporting and measurement data analysis
• Review and validation of existing simulation models

How I work: clear problem definition first, then a validated model with documented assumptions, and a concise report your team can act on. Fixed-scope or hourly, fully remote. Working language English (C2), German B1.

Background: 7+ years of research at Universität Siegen, Aix-Marseille Université and Paul-Drude-Institut Berlin, combining simulation with lab characterisation (electron microscopy, mechanical testing, X-ray methods). Currently on a remote freelance project in analysis software for an instrument manufacturer.

Weitere Kenntnisse

Simulation: COMSOL Multiphysics (Structural Mechanics, Heat Transfer, Piezoelectric / MEMS, Semiconductor, Acoustics), FEM, coupled nonlinear PDE systems, parametric sweeps and design studies, model verification and validation
Programming & data: Python, MATLAB, Git, automated data pipelines, signal processing
Characterisation: SEM/FIB, EBSD, AFM, digital image correlation, X-ray diffraction
Languages: English C2, German B1, Urdu (native), Punjabi, Hindi

Persönliche Daten

Sprache
  • Urdu (Muttersprache)
  • Englisch (Fließend)
  • Deutsch (Gut)
Reisebereitschaft
DACH-Region
Home-Office
bevorzugt
Profilaufrufe
17
Berufserfahrung
9 Jahre und 2 Monate (seit 08/2017)

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